Standard Specifications
|
Growth method
|
LEC
|
Diameter ( mm )
|
50.8
|
Thickness ( um )
|
500 +/-25 um
|
Conductivity
|
Semi-conducting
|
Orientation
|
<100> , <111> , <110>
|
Off orientation
|
From 2° to 10° off
|
Flat options
|
EJ or US SEMI. Std .
|
Surface finish
|
One side or two sides polished
|
EPD ( cm-2)
|
< 1000 or < 10000
|
Grade
|
Epi polished grade , mechanical grade
|
Package method
|
Single wafer container with outer foil bag
|
|